Microtechnology/Materials

Materials

Overview

Resources with overviews of materials and their most prominent uses:

Overview table of microfabrication materials

Microfabrication Materials Overview Table
Material Typical use Density [g/cm3] Atm. Mass[g/mol] Youngs Modulus[GPa] Shear modulus [GPa] El. Conductivity Therm. Cond.[W·m−1·K−1] Melting point[K] Notes
Aluminium Leads 2.70 26.98 70 26 26.50 nΩ·m 237 933.47 K (660.32 °C) Add notes
Gallium Arsenide Light emitter 5.3176 144.645 youngs bulk el. therm. 1238°C (1511 K) Bandgap 1.424 eV
Gallium Nitride Blue Light emitter 6.1 83.7297 youngs bulk el. therm. K ( °C) Add notes
Polysilicon solar cells den amu youngs bulk el. therm. K ( °C) highly dependent on doping and annealing. Se detailed table in the silicon section
Silicon Wafers, semiconductor 2.33 28.0855(3) 47 bulk el. 149 1687 K (1414 °C) highly dependent on doping. Se detailed table in the silicon section
Silicon dioxide, silica insulator, light waveguide den amu youngs bulk el. therm. K ( °C) Add notes
Silicon nitride insulator den amu youngs bulk el. therm. K ( °C) Add notes
Gold Coating of leads 19.3 196.966569 78 220 22.14 nΩ·m 318 1337.33 K (1064.18 °C) Add notes
Nickel MEMS, leads den amu youngs bulk el. therm. K ( °C) Add notes
Platinum Contact pads den amu youngs bulk el. therm. K ( °C) Add notes
PMMA 1.19 50.000-950.000 youngs bulk el. therm. 378 K (105°C) glass trans. Refractive index 1.492
SU8 polymer den amu youngs bulk el. therm. K ( °C) Add notes
Tungsten den amu youngs bulk el. therm. K ( °C) Add notes

This table should be merged with the above...

Metal Material Properties
Mechanical Thermal Electrical
Yield Str. Youngs. Pois. Density Th. Cond. Th. Exp. Melting El. cond. α
Highest Z Material GPa GPa ? kg/m³ (W/cmK) (ppm/K) K Ωm promille/K
Metals
34 Al 0.17 70 0.34 2698 2.36 23 660 26.5*10?? 4.3
55 Au ? 78-80 0.44-0.25 19281 3.12 14 1064 23-22.1*10?? 3.7
66 Cr ? ? ? 7194 ? ? 1860 ?
55 Ti 0.23 116 0.32 4508 0.2 8.5 1670 420*10?? 3.8
80 Pt 0.12 168 0.38 21450 0.73 8.9 1772 0.0981? 3.9
78 W 0.12 411 0.28 19254 1.8 4.5 3387 0.0489? 4.8
65 Ag ? ? ? ? ? ? 960 15.9*10??
56 Fe 12.6 196 0.29 7873 0.803 11.7-12 1540 89E 6.6
Semimetals
12 Graphite ? ? ? 2266 ? ? 3700 7-60E -0.4
Semiconductors
25 Si intrinsic 7 190 ? 2329 1.57 2.33 1410 2.5*10³
25 poly Si ? 150-170 0.3-0.066 2320 0.5-0.34 2.6 ? 22000
25 SiC 21 700 ? 3200 3.5 3.3 ? ?
45 InP ? 7.1E11 dyn cm-2 ? 4810 0.68 W cm-1 °C-1 4.60·10-6 °C-1 1060 ?
Insulators
12 Diamond 53 1035 ? 3500 20 1 ? 2.7
34 Al2O3 15.4 530 ? 4000 0.5 5.4 ? ?
25 SiO2 (bulk) 8.4 73 ? 25-2150 0.014 0.55 ? E-12

Units

  • 1 g/cm3 = 1 kg/L = 1000 kg/m3
  • g/mol = amu = Da

Applications and Uses

  • Microprocessors
  • Transistors
  • Lab-on-a-chip
  • MEMS

Product Life-Cycles

Cheap and disposable point-of-care microfluidic chips require very different materials compared to high performance microprocessors.

Environmental Considerations

The environmental footprint of microfabriaction is not discussed very often. If anyone has knowledge about this I hope they will contribute!!

Wafers and Substrates

Overview of wafer types, flats, cleaving planes etc.

References

See also notes on editing this book about how to add references Microtechnology/About#How to Contribute.


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